SMT Technologies

Manufacturing Facilities

We continue to upgrade our manufacturing facilities with state-of-the-art equipment to enhance productivity, efficiency, and quality. Our operations have now expanded into a 10, 000 cleanroom environment, further strengthening our manufacturing capabilities and ensuring higher standards of precision, cleanliness, and reliability. These continuous improvements bring greater value, long-term savings, and quality assurance to our customers. Below are some of our manufacturing facilities and equipment.

OGP Machine

Our OGP inspection machine provides accurate optical measurement and visual inspection, ensuring precise quality control, product consistency, and reliable manufacturing performance.

Auto Lid Attach Machine

Our auto lid attach machine provides precise adhesive dispensing and lid placement, ensuring strong bonding quality, stable assembly performance, and improved production efficiency.

 

DIE BOND MACHINE

Our die bond machine delivers accurate die placement and bonding with automated process control, supporting consistent quality, high reliability, and efficient semiconductor manufacturing.

 
 

TX FA MAchine

Our TX-FA automation system integrates precision motion control and intelligent inspection technology to deliver high-speed, accurate, and reliable automated manufacturing performance.

RX FA MACHINE

Our RX-FA automation system delivers precise alignment, testing, and inspection capabilities, helping improve production accuracy, process stability, and overall manufacturing efficiency.

TX LENS MACHINE

Our TX lens assembly machine provides precise optical alignment and automated assembly control, ensuring stable performance, consistent quality, and improved efficiency for optical module production.

Auto Based Attach

We utilize specialized equipment for plotting and encapsulating components, providing an extra layer of protection and reliability.

Wire Bond Machine

Our advanced wire bond machine delivers high-precision bonding performance, ensuring consistent quality, reliability, and efficiency for semiconductor and electronic manufacturing processes.

Robotics and Automation

Our advanced robotics and automation systems streamline production processes, ensuring precision and efficiency.

Plotting and Encapsulation

We utilize specialized equipment for plotting and encapsulating components, providing an extra layer of protection and reliability.

Parylene Coating Process

Our Parylene coating process enhances the durability and resistance of electronic components to environmental factors.

Auto Component Insertion

Automated component insertion ensures precision and efficiency in assembly.

2D Laser Marking

High-precision 2D laser marking technology ensures accurate and permanent markings on components.

SMT Process

Surface Mount Technology (SMT) assembly lines are equipped with cutting-edge machinery for efficient and precise component placement.

AQUEOUS WASH PROCESS

Our advanced aqueous wash process ensures thorough cleaning of components, meeting the highest cleanliness standards.

Wave Soldering / Selective Wave Soldering, Robotic Soldering /Backend Process

We employ state-of-the-art wave soldering and selective wave soldering techniques for precise soldering.

Hot Bar and ACF Process

Hot bar and Anisotropic Conductive Film (ACF) processes ensure secure connections in component assembly.

Auto Conformal Coating Process

Automated conformal coating processes guarantee consistent and reliable protection for electronic components.

High Filtration Face Mask Production

We also have facilities for the production of high-filtration face masks, meeting critical healthcare needs.