1. SURFACE MOUNT TECHNOLOGY
Siemens/ASM Siplace D series, HS & HF Series, Panasonic CM602, CM212 Series.
2. SCREEN PRINTERS
High Speed MPM Hie, DEK and Minami.
3. FINE PITCH/ODD FORM PLACEMENT
Siemens, Panasonic.
4. CONVECTION REFLOW
Vitronics Soltec, Electrovert, Tamura
5. X-RAY INSPECTION SYSTEM
Verifier Focal Spot
6. X-RAY FLUORESCENCE SPECTROMETER FOR ROHS VERIFICATION
EDX720 Shimadzu
7. FINE PITCH/BGA RE-WORK
Den-on & BGA Re-balling Set
8. WAVE SOLDER MACHINE
Electrovert, Song-E.
9. IN CIRCUIT TESTING
HP3070 Series III, Teradyne, Tescon.
10. AOI MACHINES
SAKI and I-system In-line and off-line.
11. SPI MACHINES
Inline Koh Young Zenith 3D SPI.
12. CONFORMAL COATING MACHINE
DIMA HC 200.
WORLD FASTEST KOH YOUNG 3D AOI
1. WAVE SOLDER MACHINES
Electrovert, Song-E
2. SELECTIVE WAVE SOLDERING
Koki (Semi Auto) , JTU - Inline.
3. ROBOTIC SOLDER MACHINE
Quick 9320 series.
4. CONFORMAL SOLDER MACHINEE
DIMA HC 200, ANDA TF-450.
5.BATCH AQUEOUS WASH MACHINE
Kolb PSB600 & 500.
6. PARYLENE COATING MACHINE
SCS
7. ULTRASONIC WELDING MACHINE
EGA 2014
8. HOT BAR HEAT STAKE MACHINE
Cherusal TM-101PRII
8.FINE PITCH/BGA RE-WORK
Den-on & BGA Re-balling Set
DYE & PRY TEST & CROSSES-SECTIONAL KIT
1. IN CIRCUIT TESTING
HP3070 Series III, Teradyne, Tescon.
2. RELIABILITY CHAMBERS
(- 40 ~ 120 Degree C, with humidity control).
3. HIGH POWER SCOPE
TAGARNO.
4. X-RAY INSPECTION SYSTEM
Focal Spot , SEC SF160F 3D X-Ray Inspection System
5.X-RAY FLUORESCENCE SPECTROMETER FOR ROHSVERIFICATION
Shimadzu EDX720.
BoxBuild
More than 2500m2 production space for complete box build product, with standard main assembly line (35,000mm (115 ft)(L) x 8,500mm (28 ft) (W))-suitable for consumer electronics, telecommunication & computer products.
Clean room (temperature/climate controlled) main assembly line for medical devices assembly
Product Traceability andOnline Monitoring
Reliable and live production system, Advance Real- Time Monitoring System (ARMS) provides:-
Online barcode scanning, from incoming, production up to outgoing shipment, use bar code to monitor and trace products identification up to BOM level.